Stamped Fin Heatsinks
For manufacturers with electronics production needs that require an innovative and cost-effective approach to a variety of thermal application designs, the use of stamped fin heatsinks is often the best option available. Taking advantage of stamping technology, the makers of these devices are able to configure a wide variety of shapes and sizes for the heatsink fins. Made out of copper or aluminum - the most common thermal conductors used in heatsinks - these stamped heat sink fins provide some of the most adaptive solutions on the market today. Not only can they be manufactured at an extremely light weight, but they are also able to be used for operations with volumes ranging from medium to high. One of the best features yet is their extreme efficiency which makes them ideal for minimally sized packages.
The major improvements that stamped fin heat sinks have been able to achieve over conventional heat sink designs include a long list of features ranging from extreme fin thinness to high density and from limited restrictions on fin height to strong levels of compatibility with external attachments when they are needed. The thinness that fins can achieve with stamped fin heatsink technology is dramatically more advanced than conventional extrusion heatsinks. While special cutting technique can bring extrusions down to just under a fifth of an inch, stamping is able to double the thinness. This is extremely useful for attaining the high surface area needed to effectively disperse thermal energy from the heatsink.
Stamped fin heat sinks provide the much needed solution to a variety of application requirements. For one, the combination of copper, aluminum - and sometimes nickel plating - when designing stamped fin heatsinks is exceptionally responsive to the cooling needs of increased performance circuitry, such as overclocked computers. Other uses for stamped fin heat sinks include applications with forced convection currents, chips with high power - usually over a hundred watts - and small, hard-to-fit space requirements.