Thin Fin Extrusion


Just as one of the most important aspects of heatsink designing is providing for a high level of surface area, one of the best ways to attain this is through the use of thin fin extrusion. The idea behind this is that once the surface area reaches a high level, the thermal energy extracted from the heat source is more efficiently dissipated into the surrounding air. The only problem, then, is finding the best method for making extremely fine thins so that the heatsinks are able to function at optimal capacity. Heatsinks often have a limited amount of space in which they can operate, and so the designers often struggle to fit in as many fins as possible. By using more fins at decreased thicknesses the total surface area of the heatsink is raised significantly, and often the design option that is chosen is thin fin extrusion.

Not difficult to discern from its name, this heat sink relies on extrusion technology through which the super fine thins are thrust outward from the heatsink base. Unlike other extrusions, however, the thin fin technology actually maximizes the benefits of ambient air cooling, making this not only a top performer, but a cost effective one as well. Indeed, the makers of thinly finned extrusions have been able to attain levels of fin width as little as one to three tenths of an inch, making this design one of most effective cooling devices on the market today.

Ideal for high volume applications, thin fin extrusion heatsinks have been able to harness the cooling power of surface area without losing the conductivity necessary to make a heatsink work. While they are very extremely space efficient - able to be manufactured in small packages - they provide one of the better solutions for thin cutting that is available to electronics manufacturers today.