bga heatsinks

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bga heatsinks

Cooliance has a strong offering of BGA heat sinks. We specialize in providing industry leading mechanical attach solutions that allow the heat sink to attach to the chip without adhesives or holes in the PCB. Our mechanical attach solutions are typically used in high reliability applications.

elliptical fin heatsinks

Cooliance's precision forging capabilities allow for a variety of standard elliptical fins ranging from 160 x 160mm with max fin height of 50mm. The elliptical wing shape is superior to an equivalent extruded straight fin heatsink as the wing shape acts to break up and fully leverage existing air flow.

pin fin heatsinks

Cooliance offers a selection of standard pin fin heatsinks. These are particularly suitable for applications where the air flow is from the top. Cooliance offers precision forged pin fin heatsinks that come in both active and passive versions. They can be forged in either aluminum or copper.

straight fin heatsinks

Cooliance offers a variety of standard forged straight fin heatsinks that come in numerous base dimensions with a max height of 15mm.

radial fin heatsinks

Cooliance offers a wide variety of standard radial fin options ranging in diameter from .5" to 3" and from 1 to 7 fins. Radial fin heatsinks do not require any specific orientation. Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without interfering with other board components.

bga heatsink selector

Enter in the specs you need to meet and we'll select one or more heatsinks that meet them!

Chip Size (mm):	Performance (°C/W):	Max Heatsink Height:	Airflow at Chip (LFM):	Type:
19 21 23 24 25 27 29 30 32.5 33 35 37.5 40 40.5 42.5 45		mm in	0 100 200 300 400 600	radial fin elliptical fin pin fin straight fin all

	Measuring Chip Size:
	Calculate Performance (°C/W):	:   °C :   °C :   W performance :   °C/W return to Selector

Our BGA Heatsinks offer the following advantages:

	Productivity	Fast, tool less application. Clip and heat sink can be attached within a few seconds Heat sink can be easily removed within seconds and reapplied
	Quality	Reliable mechanical attach mechanism ensures that heat sink will stay on over the life of the product Ensures optimal level of contact with the chip first time and every time. Manufacturing variability is reduced significantly A Predetermined contact force is designed into the product ensuring a constant and secure thermal transfer Every solution comes with a premium interface pad applied
	Design Features	Our Smart-CLIP™ attach mechanism allows the fins to extend beyond the dimensions of the chip package without interfering with other board components

Our BGA heat sinks can also be attached with thermal adhesive tape, push pins, or epoxy.